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Magazine Name : Ieee Transactions On Electronics Packaging Manufacturing

Year : 2003 Volume number : 26 Issue: 02

Colloidal Processing Of Polymer Ceramic Nanocomposite Integral Capacitors (Article)
Subject: Barium Hexaferrite
Author: Hitesh Windlass      P.Markondeya Raj     
page:      100 - 105
The Effect Of Pulse Plating Parameters On Copper Plating Distribution Of Microvia Pcb Manufacture (Article)
Subject: Printed Circuit Board
Author: K C Yung      T.M Yu     
page:      106 - 109
Meniscus Coating: A Low-Cost Polymer Deposition Method For System -On-Package (Sop) Substrates (Article)
Subject: Low Cost
Author: K Bhattacharya      G. W Moon     
page:      110 - 114
A Multiple-Perspective Design Advirsory System For Use In The Layout Design Of Printed Circuit Board Assemblies (Article)
Subject: Design
Author: Trevor Bonfield      Martin Barber     
page:      115 - 122
Determination And Comparison Of Surface Mount Component Rework Cycle Times Of Manual And Fully Automated Robotic Rework Stations For Rework Technology Selection (Article)
Subject: Automated Pcba Rework , Cycle Time Comparison
Author: Needet Geren     
page:      123 - 132
New Metrics And Scheduling Rules For Disassembly And Bulk Recycling (Article)
Subject: Discrete Event , Electronic Privacy
Author: Julie Ann Stuart      Vivi Christina     
page:      133 - 140
Electron Beam Lithography In Naoscale Fabrication: Recent Development (Article)
Subject: Direct Writing
Author: Ampere A. Tseng     
page:      141 - 149
Highly Reliable Non-Conductive Adhesives For Flip Chip Csp Applications (Article)
Subject: Au Bump
Author: Myung-Jin Yim     
page:      150 - 155
No-Flow Underfill Process Modeling And Analysis For Low Cost High Throughput Flip Chip Assembly (Article)
Subject: Analysis , Assembly , Chip Cards
Author: Chunho Kim     
page:      156 - 165
A Study Coining Processes Of Solder Bumps On Organic Substrates (Article)
Subject: Coin Tap Test
Author: Jae-Woong Na     
page:      166 - 172
Adhesive Evaluation On Low-Cost Alternatives To Thermosetting Epoxy Encapsulants (Article)
Subject: Adhesion , Encapsulant
Author: Lianhua Fan     
page:      173 - 178